| Name | Last modified | Size | Description | |
|---|---|---|---|---|
| Parent Directory | - | |||
| 6-25x25.jpg | 2022-02-26 16:50 | 866 | ||
| 6-150x150.jpg | 2022-02-26 16:50 | 2.8K | ||
| 6-300x300.jpg | 2022-02-26 16:50 | 9.7K | ||
| 6-768x768.jpg | 2022-02-26 16:50 | 65K | ||
| 6.jpg | 2022-02-26 16:50 | 205K | ||
| 7-25x25.jpg | 2022-02-28 11:42 | 834 | ||
| 7-150x150.jpg | 2022-02-28 11:42 | 3.1K | ||
| 7-300x300.jpg | 2022-02-28 11:42 | 10K | ||
| 7-768x768.jpg | 2022-02-28 11:42 | 53K | ||
| 7.jpg | 2022-02-28 11:42 | 134K | ||
| 8-25x12.jpg | 2025-11-09 00:37 | 883 | ||
| 8-150x73.jpg | 2025-11-09 00:37 | 4.8K | ||
| 8-300x146.jpg | 2025-11-09 00:37 | 13K | ||
| 8-768x374.jpg | 2025-11-09 00:37 | 56K | ||
| 8-1024x498.jpg | 2025-11-09 00:37 | 89K | ||
| 8-1536x747.jpg | 2025-11-09 00:37 | 163K | ||
| 8.jpg | 2025-11-09 00:37 | 1.8M | ||
| Applications-of-IC-S..> | 2021-07-20 14:42 | 1.2K | ||
| Applications-of-IC-S..> | 2021-07-20 14:42 | 21K | ||
| Applications-of-IC-S..> | 2021-07-20 14:42 | 64K | ||
| Applications-of-IC-S..> | 2021-07-20 14:42 | 375K | ||
| Applications-of-IC-S..> | 2021-07-20 14:42 | 666K | ||
| Applications-of-IC-S..> | 2021-07-20 14:42 | 479K | ||
| CSP-Package-25x10.png | 2021-07-20 17:26 | 611 | ||
| CSP-Package-150x63.png | 2021-07-20 17:26 | 6.7K | ||
| CSP-Package-300x126.png | 2021-07-20 17:26 | 19K | ||
| CSP-Package.png | 2021-07-20 17:26 | 24K | ||
| CSP-board-25x14.png | 2021-07-20 17:27 | 713 | ||
| CSP-board-150x86.png | 2021-07-20 17:27 | 15K | ||
| CSP-board.png | 2021-07-20 17:27 | 34K | ||
| Design-of-IC-Substra..> | 2021-07-20 10:23 | 810 | ||
| Design-of-IC-Substra..> | 2021-07-20 10:23 | 19K | ||
| Design-of-IC-Substra..> | 2021-07-20 10:23 | 69K | ||
| Design-of-IC-Substra..> | 2021-07-20 10:23 | 292K | ||
| FC-CSP-25x15.png | 2021-07-20 17:56 | 722 | ||
| FC-CSP-150x88.png | 2021-07-20 17:56 | 16K | ||
| FC-CSP.png | 2021-07-20 17:56 | 37K | ||
| FCCSP-Package-25x11.png | 2021-07-20 17:56 | 688 | ||
| FCCSP-Package-150x64..> | 2021-07-20 17:56 | 11K | ||
| FCCSP-Package-300x12..> | 2021-07-20 17:56 | 37K | ||
| FCCSP-Package.png | 2021-07-20 17:56 | 65K | ||
| Flip-Chip-Bonding-Te..> | 2021-07-20 17:14 | 58K | ||
| Flip-Chip-CSP-pcb-bo..> | 2022-02-25 14:42 | 810 | ||
| Flip-Chip-CSP-pcb-bo..> | 2022-02-25 14:42 | 3.1K | ||
| Flip-Chip-CSP-pcb-bo..> | 2022-02-25 14:42 | 7.4K | ||
| Flip-Chip-CSP-pcb-bo..> | 2022-02-25 14:42 | 31K | ||
| Flip-Chip-CSP-pcb-bo..> | 2022-02-25 14:42 | 47K | ||
| IC-Substrate-25x17.png | 2021-07-20 10:24 | 1.0K | ||
| IC-Substrate-150x100..> | 2021-07-20 10:24 | 16K | ||
| IC-Substrate-Facilit..> | 2021-07-20 17:12 | 874K | ||
| IC-Substrate.png | 2021-07-20 10:24 | 42K | ||
| IC-pcb-Chip-Scale-Pa..> | 2022-02-25 11:54 | 798 | ||
| IC-pcb-Chip-Scale-Pa..> | 2022-02-25 11:54 | 2.6K | ||
| IC-pcb-Chip-Scale-Pa..> | 2022-02-25 11:54 | 8.6K | ||
| IC-pcb-Chip-Scale-Pa..> | 2022-02-25 11:54 | 45K | ||
| IC-pcb-Chip-Scale-Pa..> | 2022-02-25 11:54 | 81K | ||
| ICS-1-25x19.png | 2021-07-20 10:25 | 1.4K | ||
| ICS-1-150x113.png | 2021-07-20 10:25 | 40K | ||
| ICS-1.png | 2021-07-20 10:25 | 134K | ||
| ICS-25x19.png | 2021-07-20 10:24 | 1.4K | ||
| ICS-150x113.png | 2021-07-20 10:24 | 40K | ||
| ICS-picture-25x8.png | 2021-07-20 10:29 | 481 | ||
| ICS-picture-150x51.png | 2021-07-20 10:29 | 15K | ||
| ICS-picture-300x102.png | 2021-07-20 10:29 | 58K | ||
| ICS-picture.png | 2021-07-20 10:29 | 292K | ||
| ICS.png | 2021-07-20 10:24 | 134K | ||
| Leon-Zhang-25x25.jpg | 2021-07-02 14:36 | 1.0K | ||
| Leon-Zhang-150x150.jpg | 2021-07-02 14:36 | 6.8K | ||
| Leon-Zhang-300x300.jpg | 2021-07-02 14:36 | 20K | ||
| Leon-Zhang-768x768.jpg | 2021-07-02 14:36 | 85K | ||
| Leon-Zhang-1024x1024..> | 2021-07-02 14:36 | 131K | ||
| Leon-Zhang.jpg | 2021-07-02 14:36 | 107K | ||
| MCP-Package-25x16.png | 2021-07-20 17:45 | 828 | ||
| MCP-Package-150x93.png | 2021-07-20 17:45 | 11K | ||
| MCP-Package-300x187.png | 2021-07-20 17:45 | 34K | ||
| MCP-Package.png | 2021-07-20 17:45 | 36K | ||
| MCP-board-25x16.png | 2021-07-20 17:45 | 797 | ||
| MCP-board-150x94.png | 2021-07-20 17:45 | 18K | ||
| MCP-board.png | 2021-07-20 17:45 | 39K | ||
| PBGA-1-25x8.png | 2021-07-20 16:29 | 600 | ||
| PBGA-1-150x48.png | 2021-07-20 16:29 | 7.6K | ||
| PBGA-1-300x96.png | 2021-07-20 16:29 | 23K | ||
| PBGA-1.png | 2021-07-20 16:29 | 20K | ||
| PBGA-25x8.png | 2021-07-20 15:50 | 600 | ||
| PBGA-150x48.png | 2021-07-20 15:50 | 7.6K | ||
| PBGA-300x96.png | 2021-07-20 15:50 | 23K | ||
| PBGA-board-25x15.png | 2021-07-20 15:50 | 827 | ||
| PBGA-board-150x88.png | 2021-07-20 15:50 | 14K | ||
| PBGA-board.png | 2021-07-20 15:50 | 37K | ||
| PBGA.png | 2021-07-20 15:50 | 20K | ||
| PCB-application-in-t..> | 2021-07-12 22:34 | 895 | ||
| PCB-application-in-t..> | 2021-07-12 22:34 | 14K | ||
| PCB-application-in-t..> | 2021-07-12 22:34 | 47K | ||
| PCB-application-in-t..> | 2021-07-12 22:34 | 140K | ||
| POP-Package-25x9.png | 2021-07-20 18:01 | 758 | ||
| POP-Package-150x54.png | 2021-07-20 18:01 | 11K | ||
| POP-Package-300x107.png | 2021-07-20 18:01 | 32K | ||
| POP-Package.png | 2021-07-20 18:01 | 32K | ||
| POP-board-25x15.png | 2021-07-20 18:01 | 725 | ||
| POP-board-150x93.png | 2021-07-20 18:01 | 16K | ||
| POP-board.png | 2021-07-20 18:01 | 35K | ||
| SIP-Package-25x10.png | 2021-07-20 17:51 | 578 | ||
| SIP-Package-150x62.png | 2021-07-20 17:51 | 7.8K | ||
| SIP-Package-300x123.png | 2021-07-20 17:51 | 25K | ||
| SIP-Package.png | 2021-07-20 17:51 | 24K | ||
| SIP-board（System-I..> | 2022-02-28 12:01 | 816 | ||
| SIP-board（System-I..> | 2022-02-28 12:01 | 2.8K | ||
| SIP-board（System-I..> | 2022-02-28 12:01 | 8.8K | ||
| SIP-board（System-I..> | 2022-02-28 12:01 | 49K | ||
| SIP-board（System-I..> | 2022-02-28 12:01 | 90K | ||
| SIP-board-25x14.png | 2021-07-20 17:51 | 732 | ||
| SIP-board-150x84.png | 2021-07-20 17:51 | 16K | ||
| SIP-board.png | 2021-07-20 17:51 | 34K | ||
| TLP-of-ICS-25x19.png | 2021-07-20 15:42 | 1.2K | ||
| TLP-of-ICS-150x115.png | 2021-07-20 15:42 | 27K | ||
| TLP-of-ICS-300x230.png | 2021-07-20 15:42 | 95K | ||
| TLP-of-ICS-768x589.png | 2021-07-20 15:42 | 489K | ||
| TLP-of-ICS.png | 2021-07-20 15:42 | 576K | ||
| The-Capabilities-of-..> | 2021-07-20 18:10 | 159K | ||
| ic-substrate-1-25x24..> | 2025-08-28 15:02 | 1.0K | ||
| ic-substrate-1-150x1..> | 2025-08-28 15:02 | 5.7K | ||
| ic-substrate-1-300x2..> | 2025-08-28 15:02 | 18K | ||
| ic-substrate-1-768x7..> | 2025-08-28 15:02 | 76K | ||
| ic-substrate-1.jpg | 2025-08-28 15:02 | 39K | ||
| manufacturering-cont..> | 2021-07-20 09:48 | 891 | ||
| manufacturering-cont..> | 2021-07-20 09:48 | 7.1K | ||
| manufacturering-cont..> | 2021-07-20 09:48 | 23K | ||
| manufacturering-cont..> | 2021-07-20 09:48 | 80K | ||
| quality-supervisor-s..> | 2021-07-20 09:48 | 869 | ||
| quality-supervisor-s..> | 2021-07-20 09:48 | 5.5K | ||
| quality-supervisor-s..> | 2021-07-20 09:48 | 17K | ||
| quality-supervisor-s..> | 2021-07-20 09:48 | 65K | ||
| sayfu-Package-On-Pac..> | 2022-02-28 11:56 | 894 | ||
| sayfu-Package-On-Pac..> | 2022-02-28 11:56 | 2.9K | ||
| sayfu-Package-On-Pac..> | 2022-02-28 11:56 | 11K | ||
| sayfu-Package-On-Pac..> | 2022-02-28 11:56 | 71K | ||
| sayfu-Package-On-Pac..> | 2022-02-28 11:56 | 194K | ||
| wechat_2025-08-28_14..> | 2025-08-28 14:59 | 828 | ||
| wechat_2025-08-28_14..> | 2025-08-28 14:59 | 16K | ||
| wechat_2025-08-28_14..> | 2025-08-28 14:59 | 55K | ||
| wechat_2025-08-28_14..> | 2025-08-28 14:59 | 143K | ||
