| Item | Capacity | |
|---|---|---|
| 1 | Single and double sided SMT/PTH | Yes |
| 2 | Large parts on both sides, BGA on both sides | Yes |
| 3 | Smallest Chips size | 0201 |
| 4 | Min BGA and Micro BGA pitch and ball counts | 0.008 in. (0.2mm) pitch, ball count greater than 1000 |
| 5 | Min Leaded parts pitch | 0.008 in. (0.2 mm) |
| 6 | Max Parts size assembly by machine | 2.2 in. x 2.2 in. x 0.6 in. |
| 7 | Assembly surface mount connectors | Yes |
| 8 | Odd form parts: | Yes，Assembly by hands |
| LED | ||
| Resistor and capacitor networks | ||
| Electrolytic capacitors | ||
| Variable resistors and capacitors (pots) | ||
| Sockets | ||
| 9 | Wave soldering | Yes |
| 10 | Max PCB size | 14.5 in. x 19.5 in. |
| 11 | Min PCB Thickness | 0.02 |
| 12 | Fiducial Marks | Preferred but not required |
| 13 | PCB Finish: | 1．SMOBC/HASL |
| 2．Electrolytic gold | ||
| 3．Electroless gold | ||
| 4．Electroless silver | ||
| 5．Immersion gold | ||
| 6．Immersion tin | ||
| 7．OSP | ||
| 14 | PCB Shape | Any |
| 15 | Panelized PCB | 1．Tab routed |
| 2．Breakaway tabs | ||
| 3．V-Scored | ||
| 4．Routed+ V scored | ||
| 16 | Inspection | 1．X-ray analysis |
| 2．Microscope to 20X | ||
| 17 | Rework | 1．BGA removal and replacement station |
| 2．SMT IR rework station | ||
| 3．Thru-hole rework station |