Rigid PCB Manufacturing Capabilities
SAYFU manufactures rigid PCBs for prototypes, low-volume builds, and mass production, supporting standard multilayer boards as well as HDI, heavy copper, controlled impedance, and blind or buried via designs. The capabilities below provide a general reference for our materials, dimensions, fabrication tolerances, and surface finishes. Final manufacturability depends on the complete combination of layer count, copper weight, board thickness, hole structure, and surface finish, and will be confirmed through our DFM review before production.
| Item | Rigid PCB Capability |
|---|---|
| Layer Count | 1–30 layers |
| PCB Materials | Standard FR-4, high-Tg FR-4, halogen-free FR-4, Rogers, Taconic, Arlon and ceramic-filled laminates |
| Rigid PCB Types | Multilayer PCB, HDI PCB, backplane, blind and buried via PCB, and heavy copper PCB |
| Finished Board Thickness | 0.4–6.0 mm |
| Copper Weight | 1/3 oz–4 oz |
| Minimum Line / Space | Down to 3/3 mil, depending on copper thickness and layer position |
| Finished Mechanical Hole Size | 0.10–6.0 mm |
| Through-Hole Aspect Ratio | Up to 12:1 |
| Minimum BGA Pitch | 0.30 mm |
| Minimum BGA Pad Size | 0.20 mm |
| Maximum Finished Board Size | Up to 533 × 1,219 mm (21 × 48 in), depending on surface finish |
| Controlled Impedance Tolerance | ±10% |
| Surface Finishes | Lead-free HASL, ENIG, OSP, immersion silver, immersion tin, hard gold, soft gold and ENEPIG |
| Solder Mask | Green, matte green, black, red, blue and yellow; minimum solder mask dam 4 mil |
| Board Profile Tolerance | ±0.10 mm routing tolerance |
| Electrical Testing | Flying probe testing and dedicated test fixture |
| Quality Standard | IPC Class 2 and IPC Class 3 |
| Engineering Support | EQ and DFM feedback within 1–2 working days |