SAYFU manufactures rigid, multilayer, HDI, flexible and rigid-flex PCBs for prototype, NPI and volume production programs. Use this page to compare standard, advanced and engineering-review capability levels before submitting your design for quotation. Up to 30 Layers Min. 3/3 mil Trace/Space Min. 0.10 mm Drill 1/3 oz – 4 oz Copper ±10% Impedance PCB Manufacturing … Continued
Advanced HDI PCB Manufacturing Capabilities SAYFU supports HDI PCB fabrication for compact, high-density electronics that require microvias, fine-pitch routing, and controlled layer-to-layer interconnection. For mass production, we manufacture 1+N+1 and 2+N+2 build-up structures with up to 20 layers, while prototype builds can extend to 3+N+3 structures and up to 30 layers. Our HDI process supports … Continued
Capabilities Standard Production Build-up Layers 3+N+3 Buried Core (reinforced) 2 Layer/Multilayer, 100um thick minimum Build-up Film Dielectric Thickness 25um ~ 40um Build-up Material AFT GX-series Core Via Interconnect Laser Through Via, Mechanical Through Via Build-up Laser Via Interconnect Laser Blind Via, 60um diameter Core Layer Copper Thickness 25um typical Core Layer Line/Space (subtractive) 40um/60um minimum … Continued
PCB assembly capabilities for prototypes, NPI builds and volume production — covering SMT, through-hole, BGA assembly, component sourcing, inspection and customer-defined testing. 15 SMT Lines ±0.035 mm Placement Accuracy IC Placement ±0.025 mm 20-Zone Reflow Oven Min. Component: 01005 Max. PCB: 800 × 600 mm PCB Assembly Capabilities at a Glance SAYFU supports PCBA projects … Continued
High-Precision SMT & PCB Assembly Capabilities We provide professional Electronic Manufacturing Services (EMS), specializing in high-complexity SMT and hybrid assemblies. From ultra-small 0201 components to high-density BGA/Micro BGA packages (0.2 mm pitch), our process capabilities meet the technical requirements of advanced electronic products. Equipped with advanced X-ray inspection and 3D microscopy, we ensure the quality of … Continued
Advanced Rigid-Flex PCB Manufacturing Capabilities | SAYFU When your design demands both mechanical stability and dynamic flexibility, rigid-flex PCBs become the optimal solution.By integrating rigid boards with flexible circuits, SAYFU Group delivers high-reliability interconnect solutions for Aerospace, Medical, and Military applications where space, weight, and durability are critical. Whether you require a simple 4-layer rigid-flex … Continued
Rigid PCB Manufacturing Capabilities SAYFU manufactures rigid PCBs for prototypes, low-volume builds, and mass production, supporting standard multilayer boards as well as HDI, heavy copper, controlled impedance, and blind or buried via designs. The capabilities below provide a general reference for our materials, dimensions, fabrication tolerances, and surface finishes. Final manufacturability depends on the complete … Continued
Flexible PCB manufacturing capabilities SAYFU manufactures flexible PCBs for prototypes, low-volume builds, and mass production, supporting single-sided, double-sided, and multilayer flex circuits with adhesive or adhesiveless polyimide materials. The capabilities below provide a general reference for our flex materials, dimensions, copper thicknesses, feature sizes, coverlay, and stiffener processes. Final manufacturability depends on the complete combination … Continued
SAYFU on time delivery is the second target we are commiting to customers, more than 95% on time rate is our promise to valued customers. Unit: Days 0-1m2 1-3m2 3-5m2 5-10m2 >10m2 1L 4 5 6 7 Other quote 2L 4 5 7 8 4L 5 7 9 10 6L 6 9 10 12 … Continued