HDI PCB

Advanced HDI PCB Manufacturing Capabilities

SAYFU supports HDI PCB fabrication for compact, high-density electronics that require microvias, fine-pitch routing, and controlled layer-to-layer interconnection. For mass production, we manufacture 1+N+1 and 2+N+2 build-up structures with up to 20 layers, while prototype builds can extend to 3+N+3 structures and up to 30 layers.

Our HDI process supports RCC, FR-4, and aramid build-up materials, laser vias down to 75/200 μm via-to-land dimensions, and line/space as fine as 50/50 μm for selected prototype designs. Laser via filling, controlled impedance down to ±5%, and multiple surface finishes are available according to the stack-up and production requirements. Each project is reviewed for dielectric thickness, copper weight, via structure, registration tolerance, and overall manufacturability before production.