Flexible PCB manufacturing capabilities
SAYFU manufactures flexible PCBs for prototypes, low-volume builds, and mass production, supporting single-sided, double-sided, and multilayer flex circuits with adhesive or adhesiveless polyimide materials. The capabilities below provide a general reference for our flex materials, dimensions, copper thicknesses, feature sizes, coverlay, and stiffener processes. Final manufacturability depends on the complete combination of layer count, copper weight, polyimide thickness, coverlay, stiffener, and circuit geometry, and will be confirmed through our DFM review before production.
| Item | Flex PCB Capability |
|---|---|
| Layer Count | 1–6 layers; 1–4 layers for standard production |
| Flex PCB Materials | Adhesive and adhesiveless polyimide laminates from Shengyi, Panasonic, ThinFlex and DuPont |
| Polyimide Thickness | 0.5–4 mil, depending on the selected laminate |
| Finished Board Thickness | 0.10–0.50 mm for 1–4 layers; 0.60–0.80 mm for 5–6 layers |
| Maximum Finished Board Size | Up to 229 × 584 mm (9 × 23 in) with PI thickness ≥1 mil; 229 × 356 mm (9 × 14 in) standard |
| Base Copper Weight | 1/3 oz–2 oz |
| Maximum Finished Copper | Up to 3 oz on inner layers and 4 oz on outer layers; 2 oz standard |
| Minimum Line / Space | Down to 3/3 mil, depending on finished copper thickness |
| Minimum Laser Hole Diameter | 0.10 mm |
| Minimum Finished Half-Hole Size | 0.30 mm |
| Stiffener Options | PI stiffener, FR-4 stiffener and 3M adhesive tape |
| Coverlay Materials | Shengyi, Taiflex and DuPont coverlay systems |
| Coverlay Alignment Tolerance | ±2 mil; ±4 mil standard |
| Minimum Coverlay Bridge | 8 mil |
| Coverlay Opening to Conductor | Minimum 3 mil; 4 mil standard |
| Minimum Solder Mask Dam | 4 mil for green solder mask; 5 mil for white solder mask |
| Laser Cutting Tolerance | ±0.05 mm |
| Controlled Impedance Tolerance | Single-ended: ±5 Ω at ≤50 Ω or ±5% above 50 Ω; differential: ±3 Ω at ≤50 Ω or ±5% above 50 Ω |
| Quality Standard | IPC Class 3 supported |