Shengyi Technology: Has developed a variety of ic substrate materials and laminated films
On May 23, Shengyi Technology stated on the investor interaction platform that the company has applied WireBond packaging substrate products in large quantities, mainly in the fields of sensors, cards, radio frequency, cameras, fingerprint identification, storage and other products. At the same time, it has been developed and applied in higher-end AP, CPU, GPU, and … Continued