Get in touch

Factory address
Factory address: Yayao Town, Heshan City Jiangmen, Guangdong Province, China

Business office and transit warehouse address: 5th Floor, No.1 Buld, Dacheng jiancai Square, Guanchang Road, Dalingshan Town, Dongguan city, Guangdong Province, 523819
Phone number
+86 136 6295 5837

Low-Volume PCB Assembly

Low-Volume PCB Assembly is designed for projects that require flexible quantities, fast turnaround, and strong engineering support before scaling to mass production. Sayfu provides professional low-volume PCB assembly services to support startups, R&D teams, and OEMs during prototype validation and early production stages.

Our low-volume PCBA solutions bridge the gap between prototype PCB assembly and full-scale manufacturing, helping you control risk, cost, and time-to-market.

📩 For a fast quote: Please send your Gerber files and BOM list to [email protected]

Why Partner with SAYFU?

Supply Chain Security: We source components strictly from authorized distributors (e.g., Digi-Key, Mouser, Arrow) to prevent counterfeit parts.

Flexible Quantities: From 1 piece (Prototype) to 1,000+ pieces (Pilot Run).

Speed: Quick-turn prototyping in as fast as 24 hours.

Quality Standard: All assemblies comply with IPC-A-610 Class 2 or Class 3 standards.

Free Design for Manufacturing (DFM) Review

Before production begins, our engineering team performs a detailed DFM Analysis on your Gerber files and BOM. This is not just a file check; it is a risk mitigation process.

We check for:

  • Footprint vs. Component mismatches.
  • Soldermask openings and spacing issues to prevent solder bridges.
  • Thermal relief and polarity clarity.

Note: By catching these engineering issues early, we save you the cost and delay of board respins.

First Article Inspection (FAI) – No Surprises

To guarantee quality in low-volume production, we implement a strict First Article Inspection (FAI) process (replacing the traditional “test board” method).

  1. Production: We assemble the first unit(s) of your order.
  2. Verification: We generate a detailed FAI report, including high-resolution photos and component verification.
  3. Approval: We wait for your explicit approval before running the remaining balance of the order.
  4. X-Ray Inspection: For boards with BGA/LGA components, we utilize X-Ray testing to inspect solder joint quality under the package, ensuring zero voids or shorts.

Design for Testing (DFT) & Quality Assurance

For higher reliability requirements, Winow offers Design for Testing (DFT) support to optimize your test coverage. We can assist in placing test points and designing fixtures for:

FCT (Functional Circuit Testing): Verification of the board’s actual function based on your test procedures.

AOI (Automated Optical Inspection): Standard on all assembly batches.

ICT (In-Circuit Testing): For checking shorts, opens, and component values.

Ready to Start Your Low-Volume Build?

Send your files for a Fast, Non-Obligatory Quote (usually within 24 hours).

  • Required Files: Gerber Files (RS-274X), BOM List (xls/csv), and Pick & Place file.
  • Email Us: [email protected]
  • 📞 Mobile / WhatsApp: +86 136 6295 5837
    💬 WeChat: +86 136 6295 5837