PCB Elektronics are the backbone of virtually all electronics devices

Quality Requirements in PCB Electronics

Printed circuit boards (PCBs) serve as the electrical interconnection platform for electronic assemblies used in consumer, industrial, medical, automotive, and aerospace applications. The overall reliability and electrical performance of the end product depend directly on the quality of PCB fabrication and assembly.

For multilayer and high-density designs, strict control of trace width/spacing, layer registration, via structure (including blind/buried vias where applicable), copper plating thickness, and impedance control is required. These parameters influence signal integrity, impedance continuity, insulation reliability, and long-term stability. Process deviations may result in open/short circuits, delamination, impedance mismatch, or early field failure.

In addition, PCB and PCBA products must maintain performance under thermal cycling, humidity exposure, and mechanical stress. Consistent lamination quality, controlled plating processes, and stable surface treatment are essential to ensure structural integrity and electrical reliability throughout the product lifecycle.

Systematic quality control and compliance with recognized industry standards are therefore fundamental requirements in PCB manufacturing.

SAYFU PCB & PCB Assembly Quality Control System

Sayfu Multilayer Circuits Co., Ltd operates under a documented quality management system and has obtained ISO9001 and ISO/TS16949 certifications.

Compliance with IPC Standards

PCB fabrication and assembly processes are implemented in accordance with relevant IPC standards, including:

IPC-A-600 (Acceptability of Printed Boards)
IPC-6012 (Qualification and Performance Specification for Rigid PCBs)
IPC-A-610 (Acceptability of Electronic Assemblies)

These standards define inspection criteria for conductor integrity, solderability, plating quality, laminate conditions, assembly workmanship, and other acceptance requirements.

Incoming, In-Process, and Outgoing Quality Control

A structured inspection system is implemented throughout production:

IQC (Incoming Quality Control): Verification of raw materials and incoming components prior to release to production.
IPQC (In-Process Quality Control): Process monitoring during key fabrication and assembly stages to ensure parameter stability and conformity to process specifications.
OQC (Outgoing Quality Control): Final inspection prior to shipment to verify compliance with customer drawings and applicable standards.

These procedures are intended to maintain process consistency and product traceability.

Impedance Testing

For impedance-controlled PCB designs, impedance testing is implemented according to project requirements. Testing may be conducted on a 100% basis or via defined sampling methodology, depending on customer specifications and contractual agreement.

Failure Analysis and Microsection Capability

Failure Analysis (FA) procedures are available to support root cause investigation in the event of quality deviations. Cross-sectional (microsection) analysis is conducted when required to evaluate internal layer alignment, plating thickness distribution, and via structure integrity.