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Factory address
Factory address: Yayao Town, Heshan City Jiangmen, Guangdong Province, China

Business office and transit warehouse address: 5th Floor, No.1 Buld, Dacheng jiancai Square, Guanchang Road, Dalingshan Town, Dongguan city, Guangdong Province, 523819
Phone number
+86 136 6295 5837

14-Layer Multilayer PCB with ENIG and Controlled Impedance

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PCB Prototype Manufacturer ,Multilayer Printed Circuit Board

General Specification:   

Layer count: 14

Finish thickness: 1.6±0.2mm

Minimum width/spacing:

Outer layer :4/5mil

Inner layer: 3.7/4mil

Minimum via diameter: 0.15mm

Surface finish: ENIG

Controlled impedance

Specialty: Inner via to line: 8mil;

Annular ring: 5mil;

Divider: 7.9mil

Application: Inverter, Transformer, Power Box, ECG, UAV etc

This product is a 14-layer multilayer PCB with ENIG finish, controlled impedance, fine outer and inner layer spacing, small via capability, and application references including inverter, transformer, power box, ECG, and UAV electronics. It is designed for projects that need high layer count routing in a standard finished board thickness range.

The board is suitable when routing density, reference plane planning, impedance behavior, and via reliability must be considered together. Specialty spacing and annular ring requirements should be reviewed with the full stack-up before quotation.

High-Layer-Count Routing Value

A 14-layer PCB gives designers more routing layers and reference planes for complex circuits. This helps support dense signal routing, power distribution, ground planning, and controlled impedance structures in a compact rigid board.

The finished thickness range keeps the board compatible with many mechanical designs, but building 14 layers into that thickness requires careful stack-up planning. Material, copper thickness, and dielectric spacing should be confirmed before production when impedance or reliability is important.

Fine Features, Vias, and ENIG Finish

The small via and fine line spacing requirements call for controlled drilling, imaging, etching, plating, and inspection. The difference between outer-layer and inner-layer spacing should be reviewed against the full stack-up and trace routing plan.

ENIG provides a flat solderable surface for assembly. For broader multilayer capability, see PCB manufacturing capabilities.

What to Confirm Before Production

Before production, confirm the stack-up, material grade, copper thickness, impedance values, via rules, annular ring requirements, surface finish, and final application environment. For power electronics, ECG, UAV, or inverter-related products, reliability expectations and operating conditions should be shared with the quotation files.

Typical Applications

This board is suitable for inverter, transformer, power box, ECG, UAV, industrial control, power electronics, and other products that need high layer count routing and controlled impedance.

Custom Multilayer PCB Manufacturing

For quotation and manufacturability review, provide Gerber files, drill files, stack-up drawing, impedance requirements, via requirements, line width and spacing rules, surface finish requirement, application notes, and expected production quantity. For file preparation questions, see the FAQ on design and technical issues.