-
SIP（System In Package）
-
MCP（Multi-Chip Package）
-
CSP(Chip Scale Package)
-
PBGA （Plastic Ball Grid Array）
-
PCB Assembly with advanced SMT Technology- 6 layers Printed circuit board
-
8L 2rank HDI Printed circuit board assembly for aviation project
-
PCB Assembly-10 Layers Printed circuit board
-
Turnkey PCB Assembly Solution-2 layers Printed circuit board
-
Single sides double layers
-
Aluminum substrate with insulating holes
-
Electrically neutral thermal path in raised
-
Double-sided Copper Base