HDI PCB Manufacturing in China for High-Density Circuit Designs
Images
General Specification:
- Layer No: 8 layer
- Panel size/mm: 101.85mm*132.36mm
- Material: FR4 IT-180A
- Finished Thickess:1.6mm
- Finished Copper: 70um
- Surface treatment: ENIG
- Soldermask: Green
- Soldermask: BLUE
- Silkscreen: White
- Special Technology:Buried Blind vias /resin plugged
This 8-layer HDI PCB is manufactured with FR4 IT-180A laminate and features blind and buried vias, resin-plugged vias, and an ENIG surface finish. Its multilayer construction supports high-density routing in designs where board space is limited.
HDI Construction
Blind and buried vias connect selected layers without passing through the entire board. This makes more routing space available on the unaffected layers and supports complex interconnections within a compact PCB layout.
Resin plugging is used as part of the via process. Combined with the 8-layer construction and ENIG finish, it meets the fabrication needs of this HDI board.
Typical Applications
PCBs with similar specifications may be used in:
- Communication equipment
- Compact control systems
- Consumer electronics
- Industrial electronics
- Devices with high-density component layouts
- Multilayer designs requiring blind and buried vias
Final suitability depends on the electrical, mechanical, thermal, and assembly requirements of the application.
Request a Similar PCB
SAYFU manufactures custom HDI PCBs based on customer-supplied design files and fabrication requirements. If your project requires a PCB similar to the one shown here, send us your Gerber files, drill files, stack-up information, fabrication notes, and order quantity for review and quotation.