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Factory address
Factory address: Yayao Town, Heshan City Jiangmen, Guangdong Province, China

Business office and transit warehouse address: 5th Floor, No.1 Buld, Dacheng jiancai Square, Guanchang Road, Dalingshan Town, Dongguan city, Guangdong Province, 523819
Phone number
+86-13312967631

RO3203 PCB material

The differences between RO3203 PCB material and domestic materials RO3203 PCB material is a high-frequency circuit board substrate produced by Rogers Corporation. It is renowned for its stability and holds a significant position in high-end radio frequency applications. Compared with it, although domestic high-frequency PCB materials are actively developing, there are still significant differences between … Continued

The Innovation and Transformation of PCB Industry

The Innovation and Transformation of PCB Industry is becoming one of the hot topics when the manufacturer are gathering. Such as all kinds of Forums, Industry Conferences and Communication Meetings. PCB, as the “Invisible Bone” of the electronics industry, is not so noticeable in common days. But it is the critical basement to connect all kinds of electronic components. … Continued

The protection and valid date of printed circuit board.

PCB surface finish,the protection and shelf life of a PCB,The protection and valid date of printed circuit board. Gold-based treatments can typically be stored for 6-12 months in vacuum-sealed packages with desiccant, while finishes like OSP or Immersion Silver have a shorter lifespan of 3-6 months.  The printed circuit board is not vacuum packaging until … Continued

Drill in PCB

The Tiny Holes That Connect Everything 1.The Purpose of Precision Drilling for PCB manufacturing in China PCB manufacturing in China for Printed Circuit Board (PCB) is the heart of modern electronics. It holds and connects all components. Indeed, the “drill” process is a vital step in making PCBs. It is a stage where accuracy is … Continued

The Standard FPC Lamination

The standard FPC lamination is a critical manufacturing process that involves bonding multiple layers of materials under controlled heat and pressure. This procedure is essential for creating reliable and high-performance flexible printed circuit boards (FPCs). Which we use widely in modern electronics due to their lightweight and bendable nature. It also has a close relation … Continued