Reflow soldering and wave soldering solve different assembly problems. Reflow is mainly used for SMT components, while wave soldering is commonly used for through-hole or selected mixed-technology assemblies. The process should follow the component and board design.
Reflow soldering for SMT assembly
In reflow soldering, solder paste is printed on pads, components are placed, and the assembly passes through a controlled heating profile. Pad design, stencil opening, component size, and board thermal mass affect the result.
For SMT component context, see patch component benefits.
Wave soldering for through-hole parts
Wave soldering moves the board over molten solder so through-hole leads can be soldered efficiently. It requires attention to component orientation, solder mask design, thermal relief, and areas that should not contact the solder wave.
Combined assembly scope is discussed in PCB fabrication and assembly service checks.
Mixed assemblies need process planning
A board with both SMT and through-hole parts may need reflow first and wave or selective soldering later. The order should be planned before layout because component placement and keep-out areas can affect manufacturability.
Fabrication process context is available in PCB circuit board production process.
What to confirm before production
Confirm soldering process, surface finish, component package, thermal limits, inspection method, and whether any parts need hand soldering or selective soldering. These decisions affect cost, reliability, and rework risk.