PCB laser marking is used to create traceability marks such as codes, logos, or identification data on a board. The value comes from readable and durable identification, but the process should not damage solder mask, substrate, copper, or nearby components.
What laser marking does
A focused laser changes the surface of the material to form a mark. Depending on the material and laser settings, the mark may come from color change, surface removal, or localized material reaction.
For board material context, see PCB substrate materials and raw materials.
Location matters
The mark should be placed where it remains readable after assembly and does not interfere with pads, copper exposure, solder mask openings, creepage clearance, or mechanical contact areas.
Manufacturing-flow context is available in PCB circuit board production process.
Material and process risks
Different solder mask colors, substrate systems, and surface finishes can respond differently to laser energy. The process window should be confirmed before mass production if readability or cosmetic consistency matters.
Factory process-control considerations are discussed in circuit board factory selection.
Verification before release
Confirm mark content, size, position, contrast, scanning method, and whether the mark will survive assembly cleaning, handling, and final inspection.