A Gerber file package is the manufacturing data that tells a PCB factory how to build the bare board. It should describe copper layers, solder mask, silkscreen, paste openings, board outline, drill data, and fabrication notes clearly enough for the supplier to quote and produce the PCB without guessing.
What a Gerber Package Should Include
A usable Gerber package normally includes copper layers, solder mask layers, silkscreen layers, paste layers if needed, board outline, drill files, and a fabrication drawing or notes. The files should match the intended layer count and stackup.
Gerber data is only one part of design release. The buyer should also provide material requirements, board thickness, copper requirements, surface finish, impedance needs, and inspection expectations. For the broader production flow, see PCB design and production process.
Layer Naming Prevents Costly Misinterpretation
Layer names should make the board structure obvious. Top copper, inner layers, bottom copper, solder mask, paste, and silkscreen should not be mixed or duplicated. If a file name is unclear, the supplier may need clarification before CAM review can proceed.
A mismatch between Gerber files and the fabrication drawing can delay quotation or production. The most common issues include missing drill data, wrong board outline, conflicting stackup notes, and solder mask openings that do not match the pads.
Drill and Via Data Need Special Attention
The drill file tells the fabricator where holes and vias belong. Plated holes, non-plated holes, slots, blind vias, buried vias, and controlled-depth features should be clearly identified.
When the board uses special via structures, the Gerber package should not rely on assumptions. The drawing should identify the via type and layer span. A related reference on PCB via types can help buyers understand why this matters.
DFM Review Starts With Complete Data
The supplier uses the released files to check spacing, annular ring, solder mask clearance, copper balance, board outline, panel constraints, and manufacturing notes. Incomplete data can turn a simple RFQ into a long clarification cycle.
Design teams should export files from the same approved layout revision and avoid mixing data from different versions. A clean release package reduces the risk of building the wrong revision.
Pre-Release Checklist
Before sending Gerber files for quotation, confirm layer count, stackup, material, board thickness, copper weight, surface finish, drill files, routed outline, impedance notes, test requirements, and revision number.
The goal is not only to send files. The goal is to send a manufacturing package that allows the supplier to understand the board function, process route, and acceptance requirements before fabrication starts.